Onto Innovation Inc. on March 16th announced the launch of the Dragonfly G5 system, a fundamentally new inspection and metrology platform delivering best‑in‑class throughput and enhanced sensitivity required to detect defects as small as 150nm and designed to be extensible for the next several generations of process technology inflections across front-end and advanced packaging applications.
A leading manufacturer of HBM selected the Dragonfly G5 system and related 3Di technology after recently concluding extensive onsite competitive evaluations of each. In this assessment, the Dragonfly G5 system delivered significant advantages in both resolution and throughput across several applications critical to HBM4 yield. The successful evaluations resulted in order commitments for double-digit numbers of Dragonfly G5 systems to support the majority of their 2D inspection needs and a similar number of orders for 3Di technology, displacing the previously established tool of record. Shipments of both the Dragonfly G5 systems and 3Di technology are expected to commence in the second quarter.
“We are proud to announce this new inspection solution which is exceeding expectations in performance and value to our customers,” said Mike Plisinski, chief executive officer of Onto Innovation. “The significantly enhanced base platform enables a suite of powerful new capabilities designed specifically to address emerging process control challenges in 3D and 2.5D packaging applications, resulting in precise defect detection while reducing nuisance defects at a compelling cost of ownership. These capabilities are expected to extend the system into new inspection applications representing more than $500 million in serviceable available market.”
New features of the Dragonfly G5 system include:
- A new optical system supporting multiple techniques such as brightfield and darkfield, delivering defect sensitivity down to 150nm at throughputs up to five times faster than the previous generation Dragonfly technology.
- A new and proprietary higher power multi‑mode illumination technology offered specifically for applications where current technologies struggle to separate sub-micron critical defects from surface variation in applications such as CMP and hybrid bonding.
- A portfolio of powerful new machine learning algorithms including flexible die‑to‑die detection which delivers enhanced detection sensitivity while significantly reducing recipe setup time which is a key advantage for customers with a large number of inspection steps.
- The new platform will continue to support all additional proprietary sensors such as Clearfind® technology, sub-surface defect inspection, and 3D metrology, providing customers the most flexible and powerful solution for a wide range of current and future process control needs.
