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Murata Unveils Automotive Chip Beads for 5.9GHz C-V2X Noise Suppression
Murata Unveils Automotive Chip Beads for 5.9GHz C-V2X Noise Suppression
Murata Manufacturing Co., Ltd. continues to push the envelope in automotive noise...
DNP Launches 2,500 mm-Width Coating Line to Boost Production Capacity by 15%
DNP: Launches 2,500 mm-Width Coating Line to Boost Production Capacity by 15%
Dai Nippon Printing Co., Ltd. (DNP) is pleased to announce the September operational...
Smart Communications Unveils SmartHUB to Simplify Digital Archiving
Smart Communications Unveils SmartHUB to Simplify Digital Archiving
Smart Communications, one of the leading providers of cloud-based enterprise customer...
AKM Launches AK491x Premium Audio Op Amps at HIGH END Vienna 2026
Technology
AKM Launches AK491x Premium Audio Op Amps at HIGH END Vienna 2026
May 20, 2026
Asahi Kasei Microdevices (AKM), a subsidiary of Asahi Kasei, has unveiled the AK491x series of premium...
TREASoURcE Accelerates Circular Economy Scale Across Sectors and Regions
Technology
TREASoURcE Accelerates Circular Economy Scale Across Sectors and Regions
May 19, 2026
Across Europe, many circular economy solutions struggle to move beyond isolated pilots and into real-world...
TetraMem Unveils 22nm Multi-Level RRAM AI Compute SoC
Technology
TetraMem Unveils 22nm Multi-Level RRAM AI Compute SoC
May 18, 2026
TetraMem Inc., a Silicon Valley–based semiconductor company developing analogue in-memory computing (IMC)...
Teledyne Launches Kaleido SWIR Camera for High-Speed Industrial Inspection
Technology
Teledyne Launches Kaleido SWIR Camera for High-Speed Industrial Inspection
May 15, 2026
Teledyne DALSA, one of the global leaders in machine vision, on May 15th announced Kaleido, a groundbreaking...
Dell and Kioxia Deliver High-Capacity Flash Server with 9.8 PB Storage
Technology
Dell and Kioxia Deliver High-Capacity Flash Server with 9.8 PB Storage
May 15, 2026
Kioxia Corporation, one of the world’s leaders in memory solutions, on May 14th announced a breakthrough...
Toshiba Begins Sample Shipments of SmartMCD Motor Drive ICs with Integrated MOSFETs
Technology
Toshiba Begins Sample Shipments of SmartMCD Motor Drive ICs with Integrated MOSFETs
May 14, 2026
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has started to ship engineering samples...
Hermes Reply Unveils Brick Cognitive, the Agentic OS for Manufacturing
Technology
Hermes Reply Unveils Brick Cognitive, the Agentic OS for Manufacturing
May 14, 2026
Hermes Reply, the Reply Group company specialised in digital transformation for manufacturing, presents Brick...
Rigaku Speeds Next-Gen Semiconductor Metrology Development
Technology
Rigaku Speeds Next-Gen Semiconductor Metrology Development
May 13, 2026
Rigaku Corporation, one of the global solution partners in X-ray analytical systems and a group company...
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