Rapidus and IBM partner to advance chiplet packaging technology

From left to right: Atsuyoshi Koike, President and CEO, Rapidus, and Norishige Morimoto, Vice President of IBM Japan, Chief Technology Officer, IBM Research & Development

Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM, recently announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies will collaborate with a goal of further innovating in this space. […]