Stellantis signs MoU with Foxconn for a new family of semiconductor chips

Stellantis and Hon Hai Technology Group, (Foxconn) today announced the signing of a non-binding memorandum of understanding to create a partnership with the intent to design a family of purpose-built semiconductors to support Stellantis and third-party customers. This partnership was announced as part of the Stellantis Software Day 2021 event where the Company unveiled STLA […]