Samsung Develops Hybrid Substrate cube for semiconductors
Samsung Electronics, a world leader in advanced semiconductor technology, announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology. H-Cube solution, which is jointly developed with Samsung Electro-mechanics (SEMCO) and Amkor Technology, is […]
