Nordson Electronics Unveils 99% Yield PLP Solution for Powertech Technology, Inc.
Nordson Electronics Solutions, one of the global leaders in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI), saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about […]
