Toshiba Introduces 3300V SiC MOSFET Module with High Surge Capability

Toshiba: IX800FXF2YMS4, a 3300V, 800A dual SiC MOSFET module with 300kAs It capability for industrial equipment. (Image Credit: Business Wire)
Toshiba: IX800FXF2YMS4, a 3300V, 800A dual SiC MOSFET module with 300kAs It capability for industrial equipment. (Image Credit: Business Wire)

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) recently has expanded its lineup with the launch of “IX800FXF2YMS4,” a dual SiC MOSFET module for industrial equipment, including railway vehicles, renewable energy power generation systems and power conversion systems. The new module features Toshiba’s third-generation silicon carbide (SiC) MOSFET chips, a drain-source voltage rating of 3300V and a drain current (DC) rating of 800A. Its specifications state an It limit value in the diode section, an indicator of surge current capability.

Manufacturers of industrial equipment, including railway traction inverters and converters, renewable energy power generation systems, and industrial motor control equipment, must constantly meet increasing demands for higher efficiency, smaller size and improved reliability. In these systems, large surge currents that can flow through power semiconductor modules in abnormal conditions must be countered by a sufficient surge current capability.

IX800FXF2YMS4 has an optimized SiC chip design and delivers an It characteristic of 300kAs, an indicator of the diode section’s surge current capability under abnormal conditions.

The module has a drain-source on-voltage (sense) (VDS(on)sense) of 1.4V (typ.), which helps reduce conduction losses. Its turn-on switching loss (Eon) of 185mJ (typ.) and turn-off switching loss (Eoff) of 175mJ (typ.) help reduce switching losses. These characteristics contribute to improved equipment reliability and efficiency, and to smaller cooling systems.

The new product adopts the iXPLV package, which offers excellent mounting compatibility. It uses silver sintering bonding technology to improve the heat resistance and reliability of bonded sections with SiC chips, achieving the 175°C channel temperature rating required for industrial equipment.

(Logo Credit: Business Wire)

This new addition to Toshiba’s lineup brings the number of SiC MOSFET modules in the iXPLV package to four, broadening the range of available product options.

Toshiba will continue to expand its lineup of SiC MOSFET modules for industrial equipment and provide a wider range of product options that meet diverse equipment specifications and applications. The company will also contribute to more reliable, efficient and compact industrial equipment.

Applications

Industrial equipment

  • Railway traction inverters and converters
  • Renewable energy power generation systems
  • Power conversion systems (solid-state transformers (SST); uninterruptible power supplies (UPS); energy storage systems (ESS), etc.)
  • Industrial motor control equipment, etc.

Features

  • Specifies It limit value (Diode) rating: It=300kAs
  • Low drain-source on-voltage (sense): VDS(on)sense=1.4V (typ.)
  • Low switching loss: Eon=185mJ (typ.), Eoff=175mJ (typ.)
  • Channel temperature rating: Tch=175°C
  • Adopts the iXPLV package.

Main Specifications

(Tc=25°C, unless otherwise specified)
Part numberIX800FXF2YMS4
PackageNameiXPLV
Size (mm)Typ.144×99.5×40
Absolute
maximum
ratings
Drain-source voltage VDSS (V)3300
Gate-source voltage VGSS (V)+25/-10
Drain current (DC) ID (A)800
Drain current (pulsed) IDP (A)1600
Channel temperature Tch (°C)175
Isolation voltage Visol
(Vrms)
AC, 60s6000
It limit value (Diode) It
(kAs)
Tch(initial)=175°C, VGS=-6V,
half sine-wave 10ms 1pulse,
F.R.=1%
300
Electrical
characteristics
Drain-source on-voltage (sense)
VDS(on)sense (V)
ID=800A, VGS=+20V,Tch=25°CTyp.1.4
Source-drain on-voltage (sense)
VSD(on)sense (V)
IS=800A, VGS=+20V,Tch=25°CTyp.1.4
Source-drain off-voltage (sense)
VSD(off)sense (V)
IS=800A, VGS=-6V,Tch=25°CTyp.2.2
Stray inductance LsPN (nH)P terminal-N terminalTyp.12
Turn-on switching lossEon (mJ)VDD=1800V, ID=800A,
VGS=+20V/-6V,
Cgs=100nF, RG(on)=1.2Ω,
RG(off)=1.2Ω, Tch=175°C,
LS≃70nH
Typ.185
Turn-off switching lossEoff (mJ)Typ.175

Follow the link below for more on the new product.
IX800FXF2YMS4

Follow the link below for more on Toshiba’s SiC power device lineup.
SiC Power Devices

* iXPLV is a trademark of Toshiba Electronic Devices & Storage Corporation.
* Other company names, product names, and service names may be trademarks of their respective companies.
* Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

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