Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (“IoT”) devices worldwide, recently announced an industry-first chipset for 10G passive optical network (PON) optical line terminal (OLT) applications.
As network operators globally begin scaling to 50G PON deployments, equipment vendors need to support multiple generations of PON technology—GPON (2.5Gbps), XGS-PON (10Gbps) and 50G PON, all within a space-constrained SFP-DD module form factor. Furthermore, 50G OLT systems require high SFP-DD port density making module power a critical design priority.
The GN7153C OLT combo IC and GN28L46 burst-mode transimpedance amplifier (TIA) bring a new level of integration, low power and design flexibility to optical module manufacturers and broadband system vendors developing next-generation fiber broadband infrastructure.
The chipset pairs the GN7153C, a 10G PON OLT combo IC integrating a dual-rate burst-mode limiting amplifier and laser bias driver outputs, with the GN28L46, a high-sensitivity burst-mode TIA. Together, they form a tightly integrated solution for 10 gigabit symmetric passive optical network (XGS-PON) applications compliant with ITU-T G.9807.1 standards.
The GN7153C uses lower supply voltages to deliver up to 400mW of savings per port, across a fully populated 16-port optical line terminal, that aggregates to 6.5W of system-level power savings.
The GN28L46 has an accurate Received Signal Strength Indicator (RSSI) mirror, together with the burst-mode sample-and-hold circuit in the GN7153C, that improves accuracy and eliminates the need for standalone RSSI controllers, further reducing component count and BOM cost.
“The GN7153C enables module suppliers and system vendors to realize the promise of 50G PON infrastructure,” said Amit Thakar, vice president, signal integrity product marketing at Semtech. “By integrating the SOA driver, on-chip RSSI and dual TOSA bias driver outputs into a single device—and pairing it with the industry-leading sensitivity of the GN28L46 TIA—we are giving our customers the design flexibility and power efficiency they need to build the next generation of triple-gen optical line terminal modules.”
The GN7153C and GN28L46 chipset is currently available for sampling. Volume production is scheduled for September 2026.
