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Murata Unveils its First 10µF50V MLCC in 0805 Size for Automotive Use
Murata Unveils its First 10µF/50V MLCC in 0805 Size for Automotive Use
Murata Manufacturing Co., Ltd. has announced that the new GCM21BE71H106KE02 multilayer...
Scanfil Boosts Medtech & Life Science Client Base with Liquid Instruments Agreement
Scanfil Boosts Medtech & Life Science Client Base with Liquid Instruments Agreement
Scanfil and Liquid Instruments have signed a manufacturing outsourcing agreement...
Gradiant Unveils its First Fully Integrated Lithium Plant Using Oilfield Produced Water
Gradiant Unveils its First Fully Integrated Lithium Plant Using Oilfield Produced Water
Gradiant, one of the global leaders in advanced water and resource recovery, announced...
TREASoURcE Accelerates Circular Economy Scale Across Sectors and Regions
Technology
TREASoURcE Accelerates Circular Economy Scale Across Sectors and Regions
May 19, 2026
Across Europe, many circular economy solutions struggle to move beyond isolated pilots and into real-world...
TetraMem Unveils 22nm Multi-Level RRAM AI Compute SoC
Technology
TetraMem Unveils 22nm Multi-Level RRAM AI Compute SoC
May 18, 2026
TetraMem Inc., a Silicon Valley–based semiconductor company developing analogue in-memory computing (IMC)...
Teledyne Launches Kaleido SWIR Camera for High-Speed Industrial Inspection
Technology
Teledyne Launches Kaleido SWIR Camera for High-Speed Industrial Inspection
May 15, 2026
Teledyne DALSA, one of the global leaders in machine vision, on May 15th announced Kaleido, a groundbreaking...
Dell and Kioxia Deliver High-Capacity Flash Server with 9.8 PB Storage
Technology
Dell and Kioxia Deliver High-Capacity Flash Server with 9.8 PB Storage
May 15, 2026
Kioxia Corporation, one of the world’s leaders in memory solutions, on May 14th announced a breakthrough...
Toshiba Begins Sample Shipments of SmartMCD Motor Drive ICs with Integrated MOSFETs
Technology
Toshiba Begins Sample Shipments of SmartMCD Motor Drive ICs with Integrated MOSFETs
May 14, 2026
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has started to ship engineering samples...
Hermes Reply Unveils Brick Cognitive, the Agentic OS for Manufacturing
Technology
Hermes Reply Unveils Brick Cognitive, the Agentic OS for Manufacturing
May 14, 2026
Hermes Reply, the Reply Group company specialised in digital transformation for manufacturing, presents Brick...
Rigaku Speeds Next-Gen Semiconductor Metrology Development
Technology
Rigaku Speeds Next-Gen Semiconductor Metrology Development
May 13, 2026
Rigaku Corporation, one of the global solution partners in X-ray analytical systems and a group company...
L&T Technology Services and Emerson Team Up to Advance Engineering Excellence
Technology
L&T Technology Services and Emerson Team Up to Advance Engineering Excellence
May 13, 2026
L&T Technology Services, one of the global leaders in AI, Digital and Engineering R&D services,...
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