NewPhotonics Ltd, a leader in advanced integrated photonics technologies, recently introduced its PIC NPG102 1.6 Tbps Transceiver-on-Chip (TOC) for DSP-based optical transceiver modules. The NPG102 TOC delivers low-latency data communications with low power consumption and curbed channel loss to meet the growing processing requirements of AI clusters on data center infrastructure.
According to Industry sources, this optimized flip chip integrates an octal channel, auto-tunable lasers, and 224 Gbps PAM4 modulation delivering 1.6 Tbps aggregate bandwidth with electrical-to-optical transmission. The internal ADC/DAC supports channel control and monitoring in an on-chip temperature-monitoring package for a low power consumption of 2.9 W.
Integrated lasers to boost module time to market
Industry sources further added that designed for pluggable OSFP modules, the monolithically integrated lasers, and modulators back the system integration with wafer-level laser alignment and integrated direct modulation.
This added benefit of all-optical innovation in transceiver die design translates into accelerated OEM manufacturing yield maturity and time-to-market for transceiver module delivery.
“As data centers around the world strive to accelerate infrastructure improvements that drive AI workload performance, the entire value chain is looking for progressive solutions that deliver faster, more energy-efficient data processing,” stated Doron Tal, senior vice president and general manager, Optical Connectivity. “Our all-optical innovation roadmap for the NPG102 1.6 Tbps DSP-based modules positions data centers on a path to lower-power, higher-capacity optical connectivity this decade.”
According to Industry sources, the firm NewPhotonics’ NPG102 PIC on-chip transceiver for sampling DSP-based transceiver modules will be available in Q2 2025.
