Nordson Electronics Unveils 99% Yield PLP Solution for Powertech Technology, Inc.
Nordson Electronics Solutions, one of the global leaders in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI), saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about […]
Global Electronics OEMs embrace NVIDIA AI technology to simulate virtual factories
NVIDIA today announced that electronics manufacturers worldwide are advancing their industrial digitalization efforts using a new, comprehensive reference workflow that combines NVIDIA technologies for generative AI, 3D collaboration, simulation and autonomous machines. Supported by an expansive partner network, the workflow helps manufacturers plan, build, operate and optimize their factories with an array of NVIDIA technologies. […]
