SumUp’s partnership with JCB to enable JCB card acceptance across its merchant network

JCB International Co., Ltd., the international operations subsidiary of JCB Co., Ltd., yesterday announced its partnership with global financial technology company SumUp, to enable acceptance of JCB Cards across SumUp’s European merchant network. With the return of international travel, the collaboration will provide new opportunities for growth for merchants by welcoming JCB’s valuable card members. […]

Fushi acquires Ascentis, reaches milestone in global expansion strategy

Fushi Technology (Shenzhen) Co., Ltd (“Fushi”) is delighted to announce its acquisition of Ascentis Pte Ltd (“Ascentis”), a leading Customer Relationship Management (“CRM”) and eCommerce SaaS solutions provider in Southeast Asia. With this acquisition, Fushi is Ascentis’ controlling shareholder, and it marks a significant milestone in Fushi’s globalization strategy. Founded in 2003, Ascentis is headquartered […]

Mitsui & Co. invests in African B2B digital technology company, Kyosk

Mitsui  & Co., Ltd. (Mitsui) is pleased to announce that Mitsui and ETG Global Limited, a company owned by the joint shareholders of ETC Group Limited (ETG, an affiliate of Mitsui), have invested in Kyosk Global Holdings (Kyosk), a technology company that has developed a Business-to-Business (B2B) digital platform. Leveraging smartphone penetration in the African […]

JCB and Vietcombank launch VCB JCB Platinum Credit Card in Vietnam

JCB International Co., Ltd., (JCBI), the international operations subsidiary of JCB Co., Ltd., Japan’s only international payment brand, and Joint Stock Commercial Bank for Foreign Trade of Vietnam (Vietcombank) announced the launch of the Vietcombank JCB Platinum Credit Card. The new Vietcombank JCB Platinum card is launched to celebrate Vietcombank’s 60th anniversary. The cardholders have […]

DNP creates high density TGV Substrate for high performance semiconductors

Dai Nippon Printing Co., Ltd. has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces conventional resin substrates (ex. FC-BGA: Flip Chip-Ball Grid Array) with a glass substrate. Through the use of high-density Through Glass Via (TGV), it is now possible to provide a higher performance semiconductor package than that based on […]