Nordson Electronics to Showcase Fluid Dispensing Tech at SEMICON Taiwan 2025
Nordson Electronics Solutions, one of the global leaders in reliable electronics manufacturing technologies, will demonstrate its latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326. On display will be the ASYMTEK Vantage dispensing system, configured with two ASYMTEK IntelliJet jet valves for high productivity and accuracy for semiconductor packaging and microelectronics manufacturing. The Vantage system offers several new and innovative […]
DNP creates high density TGV Substrate for high performance semiconductors
Dai Nippon Printing Co., Ltd. has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces conventional resin substrates (ex. FC-BGA: Flip Chip-Ball Grid Array) with a glass substrate. Through the use of high-density Through Glass Via (TGV), it is now possible to provide a higher performance semiconductor package than that based on […]
