MaxLinear Launches RackCommander Control-Plane Portfolio for Next-Generation AI Infrastructure
MaxLinear, Inc. (NASDAQ: MXL), a leader in high-performance connectivity, mixed-signal, and power-management semiconductor solutions, today introduced RackCommander, a portfolio of connectivity, monitoring, control, and power-management products that help enable modern rack-level control-plane architectures for AI, cloud, enterprise, and edge infrastructure. Building on MaxLinear’s recently announced Coronado and Laguna USB-UART solutions for AI data center control-plane connectivity, […]
Toshiba Launches Compact Arm Cortex-M4 Microcontrollers for Single-Motor Control Applications
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has started mass production of TXZ+ Family Entry‑Class M4L Group, compact microcontrollers featuring an Arm Cortex‑M4 core with a floating‑point unit (FPU) for next-generation home appliances, consumer products and industrial equipment. Demand is growing for energy efficiency, compact designs, IoT connectivity, and enhanced maintainability in home appliances, consumer products and […]
Rapidus and Cadence Collaborate on Agentic AI for Advanced SoC Design
Rapidus Corporation and Cadence (Nasdaq: CDNS) recently announced a collaboration to advance agentic AI for advanced-node system-on-chip (SoC) design by integrating the Cadence InnoStack AI Super Agent into the Rapidus AI-Agentic Design Solution (Raads). The joint effort combines Rapidus’ AI-native design and manufacturing ecosystem for advanced-node semiconductors with Cadence’s agentic AI design orchestration technology to […]
SanDisk Begins Sampling BiCS10 1Tb TLC 3D NAND Flash
Sandisk Corporation announced on July 2nd it is sampling its BiCS10 1Tb TLC, its 10th-generation 3D NAND flash memory technology. BiCS10 applies advanced lateral scaling techniques to achieve industry-leading 1Tb TLC memory density greater than 29Gb/mm2, improving bit density by 59 percent while delivering up to 4.8Gb/s interface speed, a 33 percent improvement compared with […]
Toshiba Unveils 80V N-Channel Power MOSFET for AI Data Centers
Toshiba Electronic Devices & Storage Corporation has launched “TPM1R408RH,” an 80V N-channel power MOSFET fabricated using U-MOS11-H, Toshiba’s latest-generation process. The MOSFET targets applications such as switched-mode power supplies for industrial equipment used in AI data centers and communications base stations. Shipments start on June 29th. The continuing expansion in AI processing has increased power […]
NIPPON KINZOKU Launches Sample Supply of Polished Capillary Tubes
NIPPON KINZOKU CO., LTD. (Headquarters: Minato-ku, Tokyo) announces the launch of a sample supply system for its “Internally Polished Capillary Tubes.” These tubes feature significantly enhanced internal smoothness in ultra-small sizes, realised through the development of the company’s proprietary internal polishing technology. We are currently proceeding with the design and construction of manufacturing equipment, aiming […]
AISIN Chooses Green Hills Software for AI Driver Monitoring Systems
Automotive Engineering Exposition, Green Hills Software, one of the worldwide leaders in embedded safety and security, on May 26th, announces that AISIN Corporation (AISIN) has chosen Green Hills Software as the trusted software foundation for its next-generation Driver Monitoring System (DMS) with Alcohol Detection System (DADS). Today, AISIN is developing their systems with Green Hills products […]
Rigaku Speeds Next-Gen Semiconductor Metrology Development
Rigaku Corporation, one of the global solution partners in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; “Rigaku”), announced the expansion of its development of metrology technologies for next-generation semiconductors, leveraging global research environments. As part of this initiative, Rigaku is working with imec, a world-leading semiconductor […]
L&T Technology Services and Emerson Team Up to Advance Engineering Excellence
L&T Technology Services, one of the global leaders in AI, Digital and Engineering R&D services, on May 12th announced a strategic global partnership with Emerson, one of the global automation leaders and providers of advanced test and measurement solutions. Under this engagement, LTTS will serve as a global System Integrator and technology development partner, supporting the design, deployment […]
Toshiba Unveils PCIe 6.0 and USB4 Compatible Differential Signal Switches
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched “TDS5C212MX” and “TDS5B212MX,” 2:1 multiplexer (Mux) / 1:2 demultiplexer (De‑Mux) switches that support next-generation high-speed interfaces such as PCIe 6.0 and USB4 Version 2.0. Volume shipments of the new products start recently. As servers, industrial testers, robots, and PCs continue to evolve, demand is growing for […]
