Samsung Develops Hybrid Substrate cube for semiconductors
Samsung Electronics, a world leader in advanced semiconductor technology, announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology. H-Cube solution, which is jointly developed with Samsung Electro-mechanics (SEMCO) and Amkor Technology, is […]
Intel Invests 50 Billion USD on New Chip Factories in Arizona
Intel today broke ground on two new leading-edge chip factories at the company’s Ocotillo campus in Chandler, Arizona. In a groundbreaking ceremony attended by senior government officials and community leaders, Intel CEO Pat Gelsinger celebrated the start of construction on the largest private investment in state history and reiterated the company’s commitment to investing in U.S. semiconductor […]
