The Rigaku Group will exhibit at “SEMICON Taiwan 2026,” taking place September 2 to 4, 2026, at TaiNEX 1 and 2 in Taipei.
SEMICON Taiwan is a leading international exhibition for the semiconductor industry. Taiwan is home to one of the world’s leading semiconductor ecosystems and plays a central role in the manufacturing of advanced logic, high-bandwidth memory (HBM) and advanced packaging technologies. Rigaku continues to strengthen its presence in the region, following the opening of the Rigaku Technology Center Taiwan (RTC-TW) in 2025.
In response to the growing complexity of semiconductor manufacturing for advanced logic, HBM and advanced packaging, Rigaku will showcase advanced X-ray metrology and inspection solutions at SEMICON Taiwan 2026. Covering applications from R&D through high-volume manufacturing, these solutions support process control, materials characterization and non-destructive analysis for increasingly complex semiconductor devices and packages. Visitors can also meet with Rigaku specialists at the booth to discuss specific metrology, process control and analysis needs.
Product Highlights
- XHENA AX-3000: Advanced X-ray inspection technology for 2.5D/3D packaging, designed to inspect hidden structures that are difficult to evaluate using conventional optical inspection alone. Featuring 3D laminography and automated defect identification, the system supports high-resolution, sub-micron defect detection of micro-bumps and through-silicon vias (TSVs) in CoWoS, HBM and hybrid bonding. It is currently available for customer evaluation.
- XHEMIS WX-PLP310: New X-ray analyzer for panel-level packaging (PLP) process control, available for customer evaluation. The system measures material composition and thin-film thickness across large substrates, supporting process control as advanced packaging shifts toward larger panel formats.
- XTRAIA MF Series: The series features the flagship XTRAIA MF-3400, Rigaku’s fourth-generation multifunctional X-ray metrology platform for high-throughput thin-film analysis, alongside the XTRAIA XD-3300 for high-precision measurement of advanced structures on ultra-small wafer pads.
- ONYX Series: The series supports applications in advanced packaging, HBM, hybrid bonding and BEOL process control. It combines X-ray and optical technologies for fast, non-destructive characterization of complex multilayer structures.
*1 CoWoS (Chip-on-Wafer-on-Substrate): An advanced packaging technology that integrates multiple chips in a single package.
*2 Panel-level packaging (PLP): A packaging method using large, rectangular substrates instead of round wafers, enabling more chips per production run.
Rigaku will also highlight its strategic alliance with Onto Innovation, which combines X-ray and optical technologies to advance hybrid metrology solutions for semiconductor manufacturing.
As part of Rigaku’s 75th anniversary celebration, the booth will feature Dr. Rixsee, an official brand mascot created by employees to commemorate the milestone. Visitors will also receive a complimentary Rigaku 75th Anniversary Journal, while supplies last.
Exhibition Overview
- Dates: September 2 (Wed) to 4 (Fri), 2026
- Venue: TaiNEX 1 and 2, Taipei
- Booth Number: N0592
- Schedule a Meeting: rtc.tw@rigaku.com
- SEMICON Taiwan Official Website
- Rigaku Exhibitor Booth Page
