RapidFlight acquires Local Motors Intellectual Property Portfolio
RapidFlight, an unmanned aircraft manufacturing company headquartered in Virginia, announced the successful acquisition of the intellectual property (IP) portfolio of Local Motors. This strategic move underscores RapidFlight’s unwavering commitment to deploying additive manufacturing (AM) technologies to meet its national security customers needs. By harnessing the power of 3D printing and other AM techniques, RapidFlight delivers superior-quality unmanned […]
Optomec welcomes Robert Yusin as its CEO
The Board of Directors at Optomec, a leading manufacturer of Digital Manufacturing solutions that offers 3D DED Metal printer technology and Aerosol Jet™ fine feature printer technology in supporting many application verticals, announce that Robert Yusin has accepted the role of CEO. Robert has achieved a string of successes in bringing innovative companies with solid technology […]
Sicona Battery Technologies raises AUD22 Million in funding from leading industries
Sicona Battery Technologies (“Sicona”) today announced it has raised AU$22 million in Series A funding which will be used to further the company’s development plans both in Australia and the United States. The $22 million investment was led by India’s Himadri Speciality Chemical Ltd, leading Australian venture capital investor Artesian, and Electrification & Decarbonization AIE LP, a fund managed by Waratah Capital. Riverstone Ventures, […]
BayWa r.e. and Meyer Burger enter into a patnership
BayWa r.e., a leading global clean energy company, is partnering with Meyer Burger Technology AG, a global solar technology company, to procure high-performance solar panels from its production site in Goodyear, Arizona. The offtake agreement is one of two announced by Meyer Berger in March 2023, resulting in the increase of the annual capacity of their module production in Goodyear from […]
onsemi partners with Blue Yonder to digitally transform Supply Chain Planning
As the semiconductor industry continues its growth across disruptions and inventory imbalances, onsemi (Nasdaq: ON), one of the leaders in intelligent power and sensing technologies, has chosen to implement Blue Yonder’s SaaS-based Supply Chain Planning solutions, including demand planning, supply planning, inventory optimization, and integrated business planning. onsemi creates intelligent power and sensing technologies that solve the most challenging customer problems. The company is […]
Markforged announces leadership change with two new appointments
Markforged Holding Corporation, the company strengthening manufacturing resiliency by enabling industrial production at the point of need, yesterday announced the appointments of Aaron VanDevender to the Board of Directors and Board Chairman Alan Masarek to the Compensation Committee. Additionally, Kevin Hartz announced his resignation and amicable departure from the Board of Directors. “Thanks to Kevin, […]
FortySix Venture Capital announces investment in Exum Instruments
FortySix Venture Capital LLC, (46VC), a Tulsa-based venture capital firm, announced its strategic investment in Exum Instruments’ Series A funding round, marking the first investment from their recently launched Kinetic Fund. Exum Instruments, a Denver-based scientific instruments company, has developed the revolutionary Massbox , a cutting-edge instrument that democratizes mass spectrometry analysis. Unlike traditional analytical tools that […]
Energizer to invest $43 Million for operations expansion in North Carolina
Energizer Holdings, Inc. (NYSE: ENR) yesterday announced plans to invest $43 million in expanded manufacturing operations and jobs in Asheboro, North Carolina, over the next several years. The move will also create 144 jobs over the next three years and 178 total jobs over five years. Arriving as the company commemorates 75 years in the community, the investment enables […]
L&T Technology Services and Ansys set up Center of Excellence
L&T Technology Services Limited, a leading global pure-play engineering services company, and Ansys, a global leader and pioneer of Multiphysics engineering simulation software have signed an MoU to establish the LTTS-Ansys Center of Excellence (CoE) for Digital Twin. The center will support LTTS in demonstrating industry use cases, develop future facing solutions, and enable its customers […]
DNP creates high density TGV Substrate for high performance semiconductors
Dai Nippon Printing Co., Ltd. has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces conventional resin substrates (ex. FC-BGA: Flip Chip-Ball Grid Array) with a glass substrate. Through the use of high-density Through Glass Via (TGV), it is now possible to provide a higher performance semiconductor package than that based on […]
