Infineon partners Toposens for 3D ultrasonic sensors on autonomous vehicles
Toposens, a Germany-based technology company has announced a new partnership with Infineon, a German semiconductor manufacturer, for the development of 3D obstacle detection and collision avoidance in autonomous systems. Infineon looks to implement Toposens’ proprietary 3D ultrasound technology. Toposens offers 3D ultrasonic sensors ‘ECHO ONE DK’ that leverage sound, machine vision, and advanced algorithms to […]
