McAfee and Samsung extend partnership for enhanced protection for online threats

McAfee and Samsung Extend Partnership for 10th Year, Expand AI-Powered Online Protection for Samsung Customers Around the Globe via Galaxy Store

McAfee Corp., a global leader in online protection, announced the extension of its ten-year partnership with Samsung, enabling enhanced protection for online threats to consumers’ privacy, identity and personal information. Now, Samsung mobile devices, including the Galaxy S24 Ultra, Galaxy S24, Galaxy S24+, Galaxy Tab S9 series, Galaxy Z Flip6, and Galaxy Z Fold6, come […]

The magical world of bendy and trendy smartphones

The Magical World of Bendy and Trendy Smartphones

From the humble beginnings of brick-sized mobile phones to the sleek and sophisticated smartphones of today, the mobile industry has undergone a remarkable transformation. Yet, amidst this sea of change, a new contender has emerged, all set to revolutionise the way we think about mobile devices: Foldable smartphones. Imagine a world where your smartphone seamlessly […]

Samsung launches its Rewards program for customers to earn and redeem

Samsung Gulf Electronics has announced the launch of its Samsung Rewards Program in Qatar, available to all customers wishing to purchase their favorite products, now with value-added offerings, only on samsung.com and Samsung Members App. Samsung products are highly immersive, from the latest smartphone portfolio to the cutting-edge wearables line-up. With more customization possibilities and […]

QCT Collaborates with Samsung and Intel for Transition to PCIe Gen5

US based Quanta Cloud Technology (QCT), a global data center solution provider, today announced the validation of South Korea headquartered Samsung’s PM1743 PCIe Gen5 SSDs in their new all-flash NVMe servers powered by 4th Gen Intel Xeon Scalable processors. US based Intel’s 4th Gen Intel Xeon Scalable processors will deliver substantial compute performance across traditional data center usages with […]

Samsung Introduce 24Gbps GDDR6 DRAM for Next-gen Graphics Cards

Suwon-si, South Korea based Samsung Electronics, one of the world’s leader in advanced memory technology, recently announced that it has begun sampling the industry’s first 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) DRAM featuring 24-gigabit-per-second (Gbps) processing speeds. Built on Samsung’s third-generation 10-nanometer-class (1z)* process using extreme ultraviolet (EUV) technology, the new memory is […]

Samsung-Western Digital Collaboration Power drives Next-generation SD

Samsung Electronics Co., Ltd. and Western Digital recently announced that they have signed a memorandum of understanding (MOU) for a unique collaboration to standardize and drive broad adoption of next-generation data placement, processing, and fabrics (D2PF) storage technologies. According to the collaborative agreement between the two firms, the firms will initially focus on aligning their […]

Samsung introduces Fingerprint security IC for Biometric payments card

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, recenlty introduced its new fingerprint security IC (integrated circuit)  S3B512C  with enhanced security features. The new solution is EMVCo and Common Criteria Evaluation Assurance Level (CC EAL) 6+ certified and performs in line with Mastercard’s latest Biometric Evaluation Plan Summary (BEPS) specifications for biometric […]

Samsung becomes HCA member to expand SmartThing capabilities

Samsung Electronics announced its membership in the Home Connectivity Alliance (HCA) together with other leading manufacturers in the smart home space, aiming to promote interoperability and greater safety. Samsung Electronics is a founding member of the HCA along with Arçelik A.Ş., The Electrolux Group, Haier, GE Appliances and Trane Technologies. The alliance brings together leading […]

Samsung Develops Hybrid Substrate cube for semiconductors

Samsung Electronics, a world leader in advanced semiconductor technology, announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology. H-Cube solution, which is jointly developed with Samsung Electro-mechanics (SEMCO) and Amkor Technology, is […]

FIDO Alliance Announces Asia Pacific Authenticate Virtual Summit

The FIDO Alliance announced the agenda and speaker lineup for its free Virtual Authenticate Summit: APAC Innovation, the quarterly series of virtual seminars that delve into the FIDO approach to modern user authentication. This three-day event, being held December 8-10, 2021, features expert speakers from around the globe, with regionally specific tracks focused on strong authentication trends in […]