Samsung Develops Hybrid Substrate cube for semiconductors
Samsung Electronics, a world leader in advanced semiconductor technology, announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology. H-Cube solution, which is jointly developed with Samsung Electro-mechanics (SEMCO) and Amkor Technology, is […]
FIDO Alliance Announces Asia Pacific Authenticate Virtual Summit
The FIDO Alliance announced the agenda and speaker lineup for its free Virtual Authenticate Summit: APAC Innovation, the quarterly series of virtual seminars that delve into the FIDO approach to modern user authentication. This three-day event, being held December 8-10, 2021, features expert speakers from around the globe, with regionally specific tracks focused on strong authentication trends in […]
Samsung Introduces 14-nanometer based 16-gigabit Low Power Double Data DRAM
Samsung Electronics Co. Ltd., the world leader in advanced memory technology, announced that it has developed the industry’s first 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM, designed to drive further growth throughout the high-speed data service applications including 5G, artificial intelligence (AI) and the metaverse. In recent years, hyperconnected […]
Stellantis and Samsung SDI partner for lithium-ion batteries in the US
Stellantis, The Netherlands-based automaker and mobility provider and Samsung SDI, a South Korea-based lithium-ion manufacturer, today announced that their companies have entered into a memorandum of understanding to form a joint venture to produce battery cells and modules for North America. Targeted to start in 2025, the plant aims to have an initial annual production […]
